| 摘要 |
<p>PURPOSE: A light emitting device package and a manufacturing method thereof are provided to operate a light emitting device with AC or DC power using a light emitting package with a bridge diode. CONSTITUTION: An insulating layer is formed on a package body(110). First to fourth metal layers(121~124) are separated on the insulation layer. A first diode(130) is formed in the first well domain of the package body. A light emitting diode(170) electrically connects the second metal layer with the third metal layer. A second diode(140) is formed in the second well area of the package body.</p> |
