| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a board connection structure that prevents damage on a component such as a liquid crystal display caused by extrusion of adhesive from between wiring boards, without using a protective sheet. <P>SOLUTION: At the position of a hard wiring board 20 corresponding to the tip of the connection terminal 13 of a flexible wiring board 10, a through-hole 25 having the longitudinal direction which intersects the direction of a wiring pattern 12 formed on the flexible wiring board 10 is provided, so that surplus adhesive 30 extruding from between the wiring boards during thermocompression bonding of the flexible wiring board 10 and the hard wiring board 20 is poured. Consequently, protrusion of the surplus adhesive 30 toward the upper part of the board can be suppressed, and the damage on the component such as the liquid crystal display located directly above a thermocompression bonding part 24 can be prevented. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
