| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for housing an electronic component that includes lead-free solder joined to a lid, while having high reliability in hermetic sealing when the lid is joined to an insulating substrate via the solder, and also to provide an electronic device. <P>SOLUTION: The package for housing an electronic component is equipped with: an insulating substrate 3 having a recess 3a on the upper face and provided with a metal layer 4 surrounding the recess 3a; and a lid 1 in which a solder layer 2 is joined to a metal material of the outer peripheral part of the lower face. The solder layer 2 is joined to the metal layer 4 so as to hermetically seal an electronic component. The solder layer 2 comprises the following solder layers arranged successively from the side of the lid 1: a first solder layer 2a that is mainly composed of an alloy phase of tin and a metal component of the metal material; and a second solder layer 2b that contains a tin-bismuth alloy phase while having a bismuth phase as a main component and has the melting point lower than that of the first solder layer 2a. The melting point of the alloy phase of the tin-metal component and that of the bismuth phase are relatively high, thereby preventing melting during mounting and achieving high reliability in hermetic sealing. The solder layer 2 is lead-free. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
