| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board wherein a high-precision electric circuit is formed on an insulating substrate. SOLUTION: The circuit board includes the insulating substrate 1 which is formed by forming a resin film 2 on the outer surface of the resin film, forming a circuit trench 3 of a desired shape and depth, by forming a recess having a depth that exceeds the thickness of the resin film 2 with reference to the outer surface of the resin film 2; depositing a plating catalyst or its precursor 5 on the surface of the circuit trench 3 and the surface of the resin film 2; and then exfoliating the resin film 2, and an electroless plating film 6, which is formed on the circuit trench by performing electroless plating on the insulating substrate 1, wherein the thickness of the electroless plating film 6 is less than or equal to 0.5 of the depth of the circuit trench 3. COPYRIGHT: (C)2011,JPO&INPIT |
