Method for manufacturing semiconductor component e.g. pressure sensor, involves connecting partial region of rear side of semiconductor chip with bond pad on carrier substrate, where region is coated with through-contact filling material

摘要

The method involves connecting a semiconductor chip (110) with a starting substrate (112), where chip comprises a front side (130), which is turned towards the substrate, and a rear side (132). A through-contact filling material (142) is attached to the chip. A partial region (140) of the rear side of the chip is coated with the material. The chip is separated from the substrate and is attached to a carrier substrate. A partial region (140), which is coated with the material, of the rear side is connected with a bond pad on the carrier substrate, where the pad is made of aluminum.