发明名称 |
EPOXY-CONTAINING POLYMER COMPOUND, PHOTOCURABLE RESIN COMPOSITION COMPRISING THE SAME, METHOD FOR FORMING PATTERN, AND FILM FOR PROTECTING ELECTRIC/ELECTRONIC PART |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photocurable resin composition from which a fine pattern can be formed in widely varying thickness by irradiation with the light having a wide wavelength range. <P>SOLUTION: An epoxy-containing polymer compound has the repeating units expressed by formula (1) (wherein a, b, c, and d are each 0 or a positive number and satisfy 0<(c+d)/(a+b+c+d)≤1.0). <P>COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011094115(A) |
申请公布日期 |
2011.05.12 |
申请号 |
JP20100211649 |
申请日期 |
2010.09.22 |
申请人 |
SHIN-ETSU CHEMICAL CO LTD |
发明人 |
TAKEDA TAKANOBU;KATO HIDETO |
分类号 |
C08G77/52;C08G59/30;G03F7/004;G03F7/038;G03F7/40;H05K3/28 |
主分类号 |
C08G77/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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