发明名称 EPOXY-CONTAINING POLYMER COMPOUND, PHOTOCURABLE RESIN COMPOSITION COMPRISING THE SAME, METHOD FOR FORMING PATTERN, AND FILM FOR PROTECTING ELECTRIC/ELECTRONIC PART
摘要 <P>PROBLEM TO BE SOLVED: To provide a photocurable resin composition from which a fine pattern can be formed in widely varying thickness by irradiation with the light having a wide wavelength range. <P>SOLUTION: An epoxy-containing polymer compound has the repeating units expressed by formula (1) (wherein a, b, c, and d are each 0 or a positive number and satisfy 0<(c+d)/(a+b+c+d)&le;1.0). <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011094115(A) 申请公布日期 2011.05.12
申请号 JP20100211649 申请日期 2010.09.22
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 TAKEDA TAKANOBU;KATO HIDETO
分类号 C08G77/52;C08G59/30;G03F7/004;G03F7/038;G03F7/40;H05K3/28 主分类号 C08G77/52
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