| 摘要 |
<p>PURPOSE: A package substrate, a semiconductor package having the package substrate, and a method of manufacturing the semiconductor package are provided to perform an electrical connection test by insulting a positive terminal and a negative terminal. CONSTITUTION: In a package substrate, a semiconductor package having the package substrate, and a method of manufacturing the semiconductor package, a first circuit pattern(120) is formed on an insulating substrate(110). A second circuit pattern(130) is arranged between the first circuit patterns. A test pattern(160) electrically interlinks the same polarity terminal of first circuit patterns and second circuit patterns. A first positive terminal(122) of the first circuit pattern and the second positive terminal(132) of the second circuit pattern are arranged in a first row. A first negative terminal of the first circuit pattern and the second positive terminal(134) of the second circuit pattern are arranged in a second row.</p> |
