CURING COMPOSITION, METHOD FOR PREPARING THE SAME, LIGHT-SHIELDING PASTE, LIGHT-SHIELDING RESIN, METHOD FOR PRODUCING THE SAME, PACKAGE FOR LIGHT-EMITTING DIODE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a light-shielding paste composed of a specific component and an inorganic material and a method for forming a light-shielding resin layer of an LED package by casting the light-shielding paste only to side walls of the package.

SOLUTION: A cured product of the light-shielding paste can be formed only on the side walls of the LED package because the light-shielding paste has a low fluidity. The light-shielding resin layers can be efficiently formed only on the side walls of the LED packages to greatly improve the productivity by using the method for forming the light-shielding resin layer.

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