| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a TAB (Tape Automated Bonding) tape increasing the reliability in a semiconductor package manufacturing process by preventing generation of foreign matter such as Cu particles with no presence of a Cu or metal pattern layer in a sprocket hole part where friction is generated due to a drive roller in progress of assembling a panel with a drive IC (Integrated Circuit) or a chip/drive IC; and to provide a method of manufacturing the same. <P>SOLUTION: The TAB tape includes a wiring pattern and a metal plating layer formed on a base film. The TAB tape is configured by: having transfer regions including a sprocket hole on both sides of the base film; and including an exposure region where the base film is exposed in the transfer region. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
