| 摘要 |
A method for predicting and warning of WAT value includes the steps as follows. A key process is selected and a WAT value after finishing the key process is used as a predictive goal. A predicting model is built. One batch or plural batches of predictive wafers are prepared, and a Fault Detection and Classification data (FDC data) and a metrology data from the predictive wafers of the key process are collected. The FDC data and the metrology data collected from the predictive wafers are inputted into the predicting model for processing a normal predicting procedure, and a predictive WAT value by the predicting model is outputted. The present invention can accurately predict the WAT value, effectively monitor some specific defective wafers and continuously perform the improvement for the specific defective wafer.
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