| 摘要 |
PURPOSE: A laser processing method for manufacturing semiconductor packages is provided to prevent the boundary between holes falling due to stress which is generated in laser processing by forming holes in a slant line. CONSTITUTION: In a laser processing method for manufacturing semiconductor packages, a plurality of semiconductor packages(11) are formed on a semiconductor strip(10) into an m×n matrix arrangement structure. A hole(20) is formed in a semiconductor package at the position corresponding to a solder ball by a certain pitch(P). The hole formed in the semiconductor package is arranged along the edge of the semiconductor package in two rows. Laser is projected between the holes of the first hole row(21) to form a hole. The laser is moved to oblique direction and projects the holes in a second hole row to form a hole.
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