发明名称 HIGH-FREQUENCY PLASMA TREATMENT METHOD AND HIGH-FREQUENCY PLASMA TREATMENT APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a high-frequency plasma treatment method which can realize a plasma treatment having superior operation reliability and adequate treatment efficiency, by eliminating abnormal electrical discharge without annihilating radicals and ions, in a small power environment, when the abnormal electrical discharge such as an arc discharge occurs in a plasma state in a treatment apparatus which applies predetermined treatment onto a substrate and the like by using the plasma, and to provide a high-frequency plasma treatment apparatus therefor. <P>SOLUTION: This treatment method includes: introducing a predetermined gas into a vacuum vessel 5 in which two electrodes 61 and 62 are arranged to oppose to each other at a predetermined space; when the vacuum vessel 5 is in a regular discharge state, making a discharge-supply-signal-forming section output a high-frequency signal output from a high-frequency power source 1, and when the vacuum vessel 5 is in an abnormal electrical discharge state, making the section output a signal of which the amplitude has been modulated by the high-frequency signal and an intermediate-frequency signal having a lower frequency than that of the high-frequency signal, in such a condition that an object 7 to be treated is arranged between two electrodes 61 and 62; amplifying the maximum amplitude level of the output to a predetermined amplitude and applying the signal between the electrodes; thereby generating the discharge to form the plasma 14; and applying the predetermined treatment to the object 7 to be treated. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011094164(A) 申请公布日期 2011.05.12
申请号 JP20090246458 申请日期 2009.10.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 DEO SHINICHI;TAYA MASAKI;TOKUNAGA TAKASHI
分类号 C23C14/34;H05H1/00;H05H1/46 主分类号 C23C14/34
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