| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor, the composition having excellent fluidity and continuous molding property upon molding a package without spoiling soldering resistance and flame retardancy, and to provide a semiconductor device using the composition. SOLUTION: The resin composition for sealing the semiconductor contains a phenol resin expressed by general formula (1), an epoxy resin, an inorganic filler, a curing accelerator, and an oxidized polyethylene wax. In formula (1), two hydroxyl groups bonded to the same naphthalene group are bonded to carbon atoms different from each other on the naphthalene ring; R1 independently represents a 1-60C hydrocarbon group; (a) independently represents an integer of 0 to 5; (b) independently represents an integer of 0 to 4; and n represents an integer of 1 to 10. COPYRIGHT: (C)2011,JPO&INPIT |
