MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing highly productive multilayer printed wiring board which can manufacture the multilayer printed wiring board excellent in connection reliability through an easy step. SOLUTION: The method for manufacturing the multilayer printed wiring board includes: a step of preparing a substrate and a double-sided board which has a first conductive layer formed on one surface of the substrate and a second conductive layer formed on the other surface of the substrate; a step of forming wiring by selectively removing the first conductive layer and the second conductive layer; a step of forming a blind via hole with the second conductive layer as the bottom face and with the substrate and the first conductive layer as a wall surface by selectively removing the substrate; and a step of applying conductive paste to a first conductive layer surface as the outer periphery of the blind via hole and continuously to the bottom surface of the blind via hole where the first conductive layer and the second conductive layer are electrically connected to each other. COPYRIGHT: (C)2011,JPO&INPIT