Provided is a heat transfer device (20) which can precisely control the temperature of the entirety of a piping system (10). The heat transfer device (20) transfers heat to the piping system (10) through which fluid passes, and is comprised of a highly heat-conductive heat transfer block (30) which surrounds the piping system (10); a heat pipe (40) which is embedded in the heat transfer block (30) in the extension direction of the piping system (10); and a heater (52) which heats the heat pipe (40). The heat transfer block (30) is comprised of a plurality of split blocks (32, 34) which can be divided in the extension direction of the piping system (10).
申请公布号
WO2011055430(A1)
申请公布日期
2011.05.12
申请号
WO2009JP68832
申请日期
2009.11.04
申请人
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION;YAMAKAGE, HISAAKI;YAMADA, YOSHIHITO;HANADA, MASATO