发明名称 Fast recovery diode and its manufacturing method
摘要 <p>A fast recovery diode (1) is provided, which comprises an n doped base layer (2) with a cathode side (21) and an anode side (22) opposite the cathode side (21), a p doped anode layer (5) on the anode side (22). The anode layer (5) having a doping profile comprises at least two sublayers (51, 52, 53), wherein a first sublayer (51) has a first maximum doping concentration (515), which is between 2 * 10 16 cm -3 and 2 * 10 17 cm -3 and which is higher than the maximum doping concentration of any other sublayer (52, 53). A last sublayer (52) has a last sublayer depth (520), which is larger than any other sublayer depth (51, 53), wherein the last sublayer depth (520) is between 90 to 120 µm. The doping profile of the anode layer declines such that a doping concentration in a range of 5 * 10 14 cm -3 and 1 * 10 15 cm -3 is reached between a first depth (54), which is at least 20 µm, and a second depth (55), which is at maximum 50 µm. Such a profile of the doping concentration is achieved by using aluminium diffused layers as the at least two sublayers (51, 52, 53).</p>
申请公布号 EP2320452(A1) 申请公布日期 2011.05.11
申请号 EP20090175421 申请日期 2009.11.09
申请人 ABB TECHNOLOGY AG 发明人 VOBECKY, JAN;HEMMANN, KATI;DURAN, HAMIT;RAHIMO, MUNAF
分类号 H01L21/329;H01L29/06;H01L29/32;H01L29/36;H01L29/861 主分类号 H01L21/329
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