发明名称 |
Package for a semiconductor device |
摘要 |
<p>A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.</p> |
申请公布号 |
EP1795498(A3) |
申请公布日期 |
2011.05.11 |
申请号 |
EP20060025136 |
申请日期 |
2006.12.05 |
申请人 |
YAMAHA CORPORATION |
发明人 |
SAITOH, HIROSHI;SUZUKI, TOSHIHISA;SAKAKIBARA, SHINGO |
分类号 |
B81C3/00;B81B7/00 |
主分类号 |
B81C3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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