Semiconductor device with a plurality of solding layers and process therefor

摘要

The chip has a series of layer provided for establishing a solder connection. The series of layer comprises of a solder layer (15) and a oxidation protection layer that is adjacent to the solder layer and seen from outside of the semiconductor chip. A barrier layer is held between the solder layer and oxidation protection layer. Another barrier layer is arranged between the moistening layer and the solder layer. An independent claim is also included for a method for formation of a solder connection between a carrier and a semiconductor chip.