发明名称 Interconnection between two substrates
摘要 <p>The joint has one or more bonded wires between enlarged, capacitive connection surfaces (5,6) at the ends of the strip conductors (3,4) with an inductive conductor piece (10,11) of smaller conductor width than the strip lines inserted before the connector surfaces of the strip lines.</p>
申请公布号 EP1035585(B1) 申请公布日期 2011.05.11
申请号 EP20000104774 申请日期 2000.03.06
申请人 ERICSSON AB 发明人 KERN, STEFAN
分类号 H01L23/66;H01L23/498 主分类号 H01L23/66
代理机构 代理人
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