| 摘要 |
A semiconductor package includes a wiring board having a plurality of first electrode pads exposed on a top surface thereof, and a plurality of second electrode pads exposed on a bottom surface thereof, and the first electrode pads are electrically connected to the respective second electrode pads. A semiconductor device is mounted on the top surface of the wiring board, and includes an endless ring-shaped resistance circuit formed in an interior of the device along a periphery thereof, and a plurality of third electrode pads provided inside the resistance circuit and electrically connected to the resistance circuit. The third electrode pads are electrically connected to the first electrode pads, respectively. A sealing resin layer is formed over the first surface of the wiring board so that the device and the first electrode pads are sealed and protected by the sealing resin layer.
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