| 摘要 |
Gold bumps are located over electrode pads of a solid imaging device and an adhesive is formed over the gold bumps. A transparent plate is supported by the gold bumps and is made to adhere over the solid imaging device by the adhesive. The gold bumps and an electrode and wiring pattern formed over a circuit board are connected by gold wires. At this time the gold wires are approximately parallel to the circuit board near portions where the gold wires and the gold bumps are connected. As a result, it is easy to locate the transparent plate over the portions where the gold wires and the gold bumps are connected. By locating the adhesive over the portions where the gold wires and the gold bumps are connected, the solid imaging device can be made small and light. As a result, a smaller lighter semiconductor device is fabricated.
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