| 摘要 |
A chip package structure is provided. The chip package structure comprises a first substrate, a second substrate and a plurality of chips. Therein, one of the chips is connected to the first substrate and electrically connected to the first substrate through a via hole of the first substrate. Thereby, the second substrate does not need the via hole for electrical connection of chips and thus, the surface thereof is adapted to remain intact to allow for the disposition of conductive balls throughout the surface.
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