| 摘要 |
FIELD: metallurgy. ^ SUBSTANCE: solution contains, wt %: copper sulphate 5-10, sulphuric acid 8-10, ethylene-diamine-tetra-acetic acid and/or its sodium salts 0.01-6 and water - the rest. ^ EFFECT: strong adhesion of coating to wire, increased density and uniformity of coating, reduced porosity, and increased applicability of solution for copper coating during 60-70 days. ^ 1 tbl, 1 ex |
