发明名称 injection mold apparatus
摘要 PURPOSE: A weldless-type injection mold device is provided to reduce cycle time by quickly heating a mold by using high frequency. CONSTITUTION: A weldless-type injection mold device comprises a lower mold(200), an upper mold(300), a cooling part(400), a heating part(500), and a controller(600). The upper mold is combined with the lower mold to form a cavity. Before the release of products, the cooling part supplies cooling water to a coolant channel, which is formed on one side of lower or upper mold, and cools the mold. In the separation of upper and lower molds, the release of products, and the connection of the molds, the heating part heats the upper and lower molds and maintains injection temperature by supplying hot water, heated by high frequency, to a heating pipe(250).
申请公布号 KR20110047780(A) 申请公布日期 2011.05.09
申请号 KR20090104541 申请日期 2009.10.30
申请人 发明人
分类号 B29C45/73;B29C45/72 主分类号 B29C45/73
代理机构 代理人
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