| 摘要 |
PURPOSE: A positive photo-resist composition with high heat resistance is provided to improve the chemical resistance property of a photo-resist and overcome reflow-related problems. CONSTITUTION: A positive photo-resist composition includes an alkaline soluble resin, an alkaline soluble resin with a hardening group, a dissolution inhibitor, a photocation initiator, and a thermocation initiator, and a solvent. The hardening group includes a monomer with a carboxylic group and a monomer with a maleimide group. The photocation initiator includes a compound represented by chemical formula 1. The thermocation initiator includes a compound represented by chemical formula 2. The alkaline soluble resin is a novolak resin. |
