| 摘要 |
PURPOSE: A printed circuit board with a via pad which includes a concavo-convex pattern and manufacturing method thereof are provided to enlarge the total plating area. CONSTITUTION: A circuit pattern(12) is formed on a first insulating layer(11). A via pad(13) is separated from the circuit pattern on the first insulating layer. A concavo-convex pattern is placed on the bottom of the via pad. A second insulator(14) is formed on the via pad in which a via hole is not formed and the circuit pattern. A copper foil layer(15) is formed on the second insulator and the via hole. |
