| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent solder resistance, and to provide a semiconductor device. SOLUTION: The epoxy resin composition is used for sealing a semiconductor, and contains (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) a compound having a cyclic disulfide structure. The semiconductor device is obtained by sealing a semiconductor element by a cured product of the epoxy resin composition. COPYRIGHT: (C)2011,JPO&INPIT |
