| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing, capable of giving visual ascertainment of a curing state of the epoxy resin for sealing, and to provide a semiconductor device using the same. SOLUTION: The epoxy resin composition for sealing comprises an epoxy resin, a curing agent and a colorant as essential components, and contains a pigment changing its hue depending on temperature rise as the colorant. The hue change of the colorant is preferably an irreversible reaction, wherein the hue of the colorant changes in a range of temperature and time among curing conditions of the epoxy resin composition. COPYRIGHT: (C)2011,JPO&INPIT
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