发明名称 COOLING STRUCTURE OF IN-CIRCUIT TEST FIXTURE
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure of an in-circuit test fixture which has sufficient cooling capability and miniaturizes a heat sink. SOLUTION: While forming a vacuum in a test space 20, the in-circuit test fixture performs a circuit test by bringing probes 13 and 14 into contact with a circuit board S placed between probe plates 11 and 12, wherein it is characterized in that a cover 15 incorporating the heat sink 18 for cooling a device D is mounted on the probe plate 11 and an inlet 19 for taking in air is arranged in the cover 15. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011089956(A) 申请公布日期 2011.05.06
申请号 JP20090245486 申请日期 2009.10.26
申请人 NEC CORP 发明人 MATSUZAWA HAJIME
分类号 G01R31/28 主分类号 G01R31/28
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