发明名称 WAFER LAMINATOR DRY FILM TRANSMISSION MECHANISM
摘要 PROBLEM TO BE SOLVED: To provide a wafer laminator dry film transmission mechanism. SOLUTION: The wafer laminator dry film transmission mechanism includes a pedestal, a feed device, and a dry film planarizing apparatus. An upper part of the pedestal includes a working stage on which a dry film is spread and cutting work is allowed, and a rolling roller. The feed device feeds the dry film onto the working stage, the rolling roller allows the dry film to spread easily, the dry film planarizing apparatus clamps and stretches the dry film, and the feed device performs rolling, travels with the dry film in synchronization in a process of film switching, and holds flatness of the dry film. Accordingly, the wafer laminator dry film transmission mechanism performs operation, such as cramping and pull, to the dry film after cutting the dry film, moves in synchronization with the dry film in the process of the film switching of the feed device in synchronization, holds a flat state when non-cutting zone of the dry film is switched to the working stage, thus improving the yield of succeeding film cutting work. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011091121(A) 申请公布日期 2011.05.06
申请号 JP20090241896 申请日期 2009.10.20
申请人 CSUN MFG LTD 发明人 LAI CHIN SEN
分类号 H01L21/02;H01L21/683 主分类号 H01L21/02
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