| 摘要 |
PROBLEM TO BE SOLVED: To press a probe card against a wafer by pressure equal to or higher than the atmospheric pressure, and quickly achieve pressed contact of the probe card with the wafer. SOLUTION: The wafer inspecting device 1 includes a probe card holding mechanism 42 for holding a probe card 4 which electrically inspects a wafer 5, a wafer holding support 11 for holding the wafer 5 on the top surface and movable, and a pressing mechanism 2 for aligning the held probe card 4 with the wafer 5 and pressing the wafer holding support 11 against the probe card 4. A seal ring 13 for forming sealed space with the probe card 4 is provided at the periphery of the wafer holding support 11. The seal ring 13 in contact with the probe card 4 forms the sealed space with the wafer 5 and the probe card 4 set close to each other, and can reduce the pressure in the sealed space. COPYRIGHT: (C)2011,JPO&INPIT
|
