| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent increase in substrate thickness, as much as possible, while making it possible to form each of first and second wirings of different thickness in one-time patterning on a wiring substrate having wirings of different thickness on one surface of a wiring formation layer. <P>SOLUTION: A first wiring 30 is arranged on one surface of a wiring formation layer 10; a resin film 70 made of resin with electrical insulation property is arranged at a site other than the first wiring 30 on one surface of the wiring formation layer 10; the surface of the resin film 70 and the surface of the first wiring 30 are positioned on the same plane; and a second wiring 31 as a wiring thinner than the first wiring 30 is formed on the surface of the resin film 70. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
