发明名称 ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic component which has improved electric characteristics and bonding reliability by relaxing thermal distortion generated during through-hole sealing of a through-electrode when a terminal electrode of an intermediate electrode and an external terminal of a holding member (lid) are electrically connected to each other through the through- electrode, and to provide a method of manufacturing the electronic component. SOLUTION: A piezoelectric vibrator 10 as the electronic component is formed by mounting a piezoelectric vibrating piece layer 12 on a base substrate 44. The base substrate 44 includes first and second holes 46 and 48 formed at positions opposite the piezoelectric vibrating piece layer 12, and a sealing member 57 for sealing the first and second holes 46 and 48. The piezoelectric vibrating piece layer 12 has first and second extraction electrodes 28 and 32 formed on a principal plane opposed to the first and second holes 46 and 48, the first and second holes 46 and 48 connect with external electrodes 54 and 56 of the base substrate 44. First and second electrodes 50 and 52 are formed which electrically connect with the first and second extraction electrodes 28 and 32, and a gap 55 serving as a buffer region is provided between bottom faces of the first and second electrodes 50 and 52 and the sealing member 57. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011091173(A) 申请公布日期 2011.05.06
申请号 JP20090242861 申请日期 2009.10.21
申请人 SEIKO EPSON CORP 发明人 TSUCHIDO KENJI
分类号 H01L23/02;H01L23/12;H03H9/19 主分类号 H01L23/02
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