发明名称 METHOD OF MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component of which a tie bar can be securely cut at a desired position. SOLUTION: A metal member includes a body part 30, tie bars 24, 26, and frame parts 22a, 22b integrally formed. In such a state that the body part 30 with a substrate 12 mounted thereon is fixed, and the frame parts 22a, 22b are positioned between a pair of holding parts 52, 54 of a cutting device, the holding parts 52, 54 move, and the tie bars 24, 26 and frame parts 22a, 22b are repeatedly bent around connection parts 58s, 58t of the body part 30 and the tie bars 24, 26 to cut the metal material at the connection parts 58s, 58t. When one of the holding parts 52, 54 presses one of main surfaces 22s, 22t of the frame parts 22a, 22b, the other holding part 54 or 52 is made separate from the other main surface 22t or 22s of the frame parts 22a or 22b. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011091076(A) 申请公布日期 2011.05.06
申请号 JP20090241075 申请日期 2009.10.20
申请人 MURATA MFG CO LTD 发明人 YOSHIUCHI TSUYOSHI
分类号 H01L23/50;H01L23/02;H01L23/12 主分类号 H01L23/50
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