发明名称 |
METAL-PASSIVATING CMP COMPOSITIONS AND METHODS |
摘要 |
The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
|
申请公布号 |
US2011100956(A1) |
申请公布日期 |
2011.05.05 |
申请号 |
US201113004113 |
申请日期 |
2011.01.11 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
KELEHER JASON;SINGH PANKAJ;BRUSIC VLASTA |
分类号 |
C23F1/00;C09K13/00;C23F1/18;C23F1/30 |
主分类号 |
C23F1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|