COOLING MEMORY MODULES USING WEDGE-SHAPED HEAT SPREADERS IN THERMAL CONTACT WITH COLD PLATE BLADES AND MEMORY MODULES
摘要
<p>A cold plate has blades arranged to be interleaved with memory modules, and wedgeshaped heat spreaders are attached to the memory modules and are in thermal contact with the blades. A liquid cooling loop is thermally coupled to the blades of the cold plate.</p>
申请公布号
WO2011053313(A1)
申请公布日期
2011.05.05
申请号
WO2009US62770
申请日期
2009.10.30
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;RAU, TIMOTHY;SIMON, GLENN C.;BOLICH, BRYAN
