| 摘要 |
<p>PURPOSE: A chip on film package and manufacturing method thereof are provided to minimize the deformation of a flexible film generated during a bonding process, thereby increasing the reliability of the process. CONSTITUTION: A semiconductor chip(100) comprises a plurality of bumps(110) made of first metal and a first solder layer formed on a bump. A flexible film(200) includes a plurality of leads made of third metal and a second solder layer formed on a lead. A bonding unit(300) is formed by bonding the first and second solder layers. The bumps and the leads are electrically combined by the bonding unit. The first metal and an isolation layer made of another metal are formed between the bumps and the first solder layer.</p> |
