PROCESS FOR FABRICATING MULTI-LEVEL METAL PARTS BY THE UV-LIGA TECHNIQUE

摘要

The method involves covering a conductive surface of a substrate by a photosensitive resin layer, and irradiating the layer. The layer is developed such that openings are formed in the layer to form a resin mold. A new photosensitive resin layer (6) is deposited on the developed layer to fill the openings. The new layer is irradiated and developed such that openings are formed in the new layer to form a multi-level resin mold. A metal or an alloy is galvanically deposited in the openings of the new layer. The layers are eliminated to form a multi-level metallic structure from the metal/alloy.