发明名称 Transfer Chamber having Plate for Heat Exchange and Semiconductor Fabrication Equipment having The same
摘要 <p>PURPOSE: A transfer chamber with a plate for heat exchange and semiconductor manufacturing equipment with the same are provided to heat a substrate at a temperature which is required until a substrate is inserted into a process chamber, thereby increasing profitability by preventing the waste of heat energy. CONSTITUTION: A chamber base(170) forms the lower surface of a transfer chamber(100) making a moving space in which a substrate is transferred. At least one plate(110) is installed in the chamber base to exchange heat with the substrate. The plate comprises a heater supplying heat to the substrate A shelf(140) transfers a substrate to the transfer robot and the plate. A jetting nozzle(180) supplies nitrogen and/or a helium gas to the transfer chamber.</p>
申请公布号 KR20110045570(A) 申请公布日期 2011.05.04
申请号 KR20090102204 申请日期 2009.10.27
申请人 发明人
分类号 H01L21/68;H01L21/677 主分类号 H01L21/68
代理机构 代理人
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