发明名称 Transistor manufacture
摘要 A method in which an oxide layer is formed on material defining and surrounding an emitter window. The technique comprises depositing a non-conformal oxide layer on the surrounding material and in the emitter window, whereby the thickness of at least a portion of the oxide layer in the emitter window is smaller than the thickness of the oxide layer on the surrounding material outside the emitter window; and removing at least a portion of the oxide layer in the emitter window so as to reveal at least a portion of the bottom of the emitter window whilst permitting at least a portion of the oxide layer to remain on the surrounding material. The technique can be used in the manufacture of a self-aligned epitaxial base BJT (bipolar junction transistor) or SiGe HBT (hetero junction bipolar transistor).
申请公布号 US7935606(B2) 申请公布日期 2011.05.03
申请号 US20060911736 申请日期 2006.04.18
申请人 X-FAB SEMICONDUCTOR FOUNDRIES AG 发明人 FU JUN
分类号 H01L21/331;H01L21/8222 主分类号 H01L21/331
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