| 发明名称 |
Integrated circuit package system with lead structures including a dummy tie bar |
| 摘要 |
An integrated circuit package system includes forming lead structures including a dummy tie bar having an intersection with an outer edge of the integrated circuit package system, and connecting an integrated circuit die to the lead structures. |
| 申请公布号 |
US7936053(B2) |
申请公布日期 |
2011.05.03 |
| 申请号 |
US20060558387 |
申请日期 |
2006.11.09 |
| 申请人 |
STATS CHIPPAC LTD. |
发明人 |
PUNZALAN JEFFREY D.;BATHAN HENRY D.;SHIM IL KWON;CAMACHO ZIGMUND RAMIREZ |
| 分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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