发明名称 |
Semiconductor device using logic chip |
摘要 |
A system-in-package type semiconductor device includes a logic chip; and a memory chip connected with external terminal through the logic chip. The logic chip includes a data holding circuit configured to hold a test data in a test mode, and store the test data supplied through the data input/output terminal in the data holding circuit in response to a test data set command, and writes the test data which has been stored in the data holding circuit in the memory chip in response to the test data write command. |
申请公布号 |
US7937633(B2) |
申请公布日期 |
2011.05.03 |
申请号 |
US20080190196 |
申请日期 |
2008.08.12 |
申请人 |
RENEAS ELECTRONICS CORPORATION |
发明人 |
TAKASUGI KOUJI;KOMATSU NORIAKI;TSUNESADA NOBUTOSHI;YAMANE KAZUNORI |
分类号 |
G11C29/00 |
主分类号 |
G11C29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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