发明名称 Semiconductor device using logic chip
摘要 A system-in-package type semiconductor device includes a logic chip; and a memory chip connected with external terminal through the logic chip. The logic chip includes a data holding circuit configured to hold a test data in a test mode, and store the test data supplied through the data input/output terminal in the data holding circuit in response to a test data set command, and writes the test data which has been stored in the data holding circuit in the memory chip in response to the test data write command.
申请公布号 US7937633(B2) 申请公布日期 2011.05.03
申请号 US20080190196 申请日期 2008.08.12
申请人 RENEAS ELECTRONICS CORPORATION 发明人 TAKASUGI KOUJI;KOMATSU NORIAKI;TSUNESADA NOBUTOSHI;YAMANE KAZUNORI
分类号 G11C29/00 主分类号 G11C29/00
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