| 摘要 |
PURPOSE: A light emitting device package and a manufacturing method thereof are provided to narrow a color temperature distribution by forming a sealing member including a phosphor on a light emitting device chip between wires. CONSTITUTION: A plurality of wires(300) are formed on a light emitting device chip. A sealing unit(400) includes a phosphor on the light emitting chip between wires. The upper side of a light emitting sealing member is planar. The light emitting sealing member includes an uneven surface on the upper side thereof and at least one dummy wire. |
