METHOD OF MELT BONDING HIGH-TEMPERATURE THERMOPLASTIC BASED HEATING ELEMENT TO A SUBSTRATE
摘要
A method for producing a thermoplastic film-substrate resistive thick film heating element is described, involving the melt bonding of an electrically insulating, optionally filled high temperature thermoplastic film to a substrate. This thick film heating element includes an optionally filled high temperature thermoplastic film-substrate onto which is deposited at least a resistive thick film, and is capable of operating over a wide range of power densities for consumer and industrial heating element applications.
申请公布号
CA2777870(A1)
申请公布日期
2011.04.28
申请号
CA20102777870
申请日期
2010.10.21
申请人
DATEC COATING CORPORATION
发明人
RUGGIERO, MARY ANN;SOLTANI, REZA;YANG, MAIZHI;TALALLA, DOMINIC;OLDING, TIMOTHY RUSSELL;STOCKTON, JOHN