| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of a multilayer structure that allows efficient heat dissipation, even if arranging a heating element such as a light source in a limited area. <P>SOLUTION: Via holes 65... which communicate in the stack direction from a first conductive layer 101 constituting a surface side outer layer toward a sixth conductive layer 106 constituting a rear surface side outer layer, are formed around an orange LED23 and a blue LED. At an inner layer positioned between the first conductive layer 101 and the sixth conductive layer 106, flat heat dissipation lands 44, 54 connected to the first conductive layer 101 are provided by way of metal conductors 66..., 67... interposed in the via hole 65. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
