| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die bonding paste which has high thermal bondability, is excellent in rapid curing ability at a low temperature (low temperature-rapid curability), is excellent in storage stability, has a low water absorption rate and does not generate void when being solidified; and to provide a semiconductor device using the die bonding paste. <P>SOLUTION: The die bonding paste contains an epoxy resin (A) containing a naphthalene type epoxy resin, and an epoxy resin curing agent (B) containing a latent curing agent. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
