发明名称 |
METHOD FOR POLISHING A SEMICONDUCTOR WAFER |
摘要 |
A method of polishing a semiconductor wafer using a holding system including a lined cutout the size of the semiconductor wafer that is fixed to a carrier. The method includes holding the semiconductor wafer in the cutout through adhesion of a first side of the semiconductor wafer to a bearing surface in the cutout and polishing a second side of the held semiconductor wafer using a polishing pad that is fixed on a polishing plate while introducing a polishing agent between the second side of the semiconductor wafer and the polishing pad, the polishing pad including fixedly bonded abrasive materials. The carrier is guided during polishing such that a portion of the second side of the semiconductor wafer temporarily projects beyond a lateral edge of a surface of the polishing pad.
|
申请公布号 |
US2011097974(A1) |
申请公布日期 |
2011.04.28 |
申请号 |
US20100897063 |
申请日期 |
2010.10.04 |
申请人 |
SILTRONIC AG |
发明人 |
SCHWANDNER JUERGEN;BUSCHHARDT THOMAS;KOPPERT ROLAND |
分类号 |
B24B7/17;B24B1/00;B24B7/20 |
主分类号 |
B24B7/17 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|