发明名称 |
METHOD OF MANUFACTURING SILICON CARBIDE SUBSTRATE, AND SILICON CARBIDE SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a silicon carbide substrate, capable of reducing the manufacture cost of a semiconductor device using the silicon carbide substrate, and to provide the silicon carbide substrate. SOLUTION: The method of manufacturing the silicon carbide substrate includes: a step of preparing a base substrate 10 comprising silicon carbide and an SiC substrate 20 comprising single crystal silicon carbide; a step of forming a metal film 31 so as to be in contact on the main surface of the base substrate 10; a step of mounting the SiC substrate 20 so as to be in contact on the metal film 31 and forming a laminated substrate; and a step of bonding the base substrate 10 and the SiC substrate 20 by the metal film 31 by heating the laminated substrate. COPYRIGHT: (C)2011,JPO&INPIT
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申请公布号 |
JP2011086660(A) |
申请公布日期 |
2011.04.28 |
申请号 |
JP20090236209 |
申请日期 |
2009.10.13 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
NISHIGUCHI TARO;TAMASO HIDETO;SASAKI MAKOTO;HARADA MAKOTO;NAMIKAWA YASUO |
分类号 |
H01L21/02;H01L21/28;H01L21/336;H01L29/12;H01L29/78 |
主分类号 |
H01L21/02 |
代理机构 |
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主权项 |
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地址 |
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