| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermal diffusion apparatus achieved in configuration applicable to extremely various of uses related to heat dissipation while making a comparatively large amount of heat energy pass therethrough. <P>SOLUTION: An apparatus 10 that dissipates heat from a heat source in an operable manner includes a thermally conductive substrate 12 having a thickness that forms a planar boundary and an insert part 14 arranged at the substrate and located so as not to protrude from the planar boundary. The insert part 14 is formed of a material having thermally conductivity at least 1.5 times of the substrate material along two directions of at least X, Z axes and one of the directions of the two axes X, Z extends substantially perpendicular to both first and second surfaces 18, 20 of the substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
