发明名称 SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technique for efficiently heating a gas required for a heating treatment of a substrate. SOLUTION: This substrate processing device 1 includes a heating plate 10 formed with a gas passage 103 extending along a heating surface of a heater 14 in the inside. Air supplied into a heating plate 110 from a gas supply mechanism 16 is heated by passing through the gas passage 103. The heated air passes through an introduction opening 121 and enters a diffusion passage 102. The air is diffused in the diffusion passage 102, and ejected toward a substrate 9 from a plurality of ejection openings 101 formed on the upper surface of the heating plate 10. In such a substrate processing device 1, the air can be efficiently heated by utilizing the heat of the heating plate 10. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011086868(A) 申请公布日期 2011.04.28
申请号 JP20090240456 申请日期 2009.10.19
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 SATO TAKAYUKI;YOSHITANI MITSUAKI;TANIGUCHI TAKESHI;YAMAOKA HIDETO;NAKANE SHINGO;ISHIKAWA TOSHIJI;ABE HIROSHIGE;YONEYAMA NORITAKA
分类号 H01L21/027;B65G49/06;H01L21/677 主分类号 H01L21/027
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